The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Aug. 21, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Fee Li Lie, Albany, NY (US);

Kamal K. Sikka, Poughkeepsie, NY (US);

Donald Francis Canaperi, Bridgewater, CT (US);

Daniel A. Corliss, Waterford, NY (US);

Dinesh Gupta, Hopewell Junction, NY (US);

Dario Goldfarb, Dobbs Ferry, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/367 (2013.01); H01L 23/473 (2013.01); H01L 24/09 (2013.01);
Abstract

Techniques that facilitate a copper microcooler structure are provided. In one example, a device includes a first copper microcooler structure and a second copper microcooler structure. The first copper microcooler structure includes a first copper plate and a first set of copper channels attached to the first copper plate. The second copper microcooler structure includes a second copper plate and a second set of copper channels attached to the second copper plate. A surface of the second copper plate associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.


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