The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Jun. 16, 2016
Applicant:
Tdk Electronics Ag, München, DE;
Inventors:
Goushi Tauchi, Tokyo, JP;
Masakazu Hirose, Tokyo, JP;
Tomoya Imura, Tokyo, JP;
Tomohiro Terada, Tokyo, JP;
Assignee:
TDK ELECTRONICS AG, München, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/475 (2006.01); H01G 4/12 (2006.01); C04B 35/462 (2006.01); C04B 35/47 (2006.01); H01G 4/30 (2006.01); C04B 35/626 (2006.01); C04B 35/628 (2006.01); C04B 35/64 (2006.01); C04B 41/45 (2006.01); C04B 41/51 (2006.01); C04B 41/88 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1218 (2013.01); C04B 35/462 (2013.01); C04B 35/47 (2013.01); C04B 35/475 (2013.01); C04B 35/6262 (2013.01); C04B 35/62645 (2013.01); C04B 35/62821 (2013.01); C04B 35/64 (2013.01); C04B 41/4578 (2013.01); C04B 41/5111 (2013.01); C04B 41/88 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3227 (2013.01); C04B 2235/3229 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/602 (2013.01); C04B 2235/656 (2013.01); C04B 2235/768 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01);
Abstract
A dielectric composition, a dielectric element, an electronic component and a multi-layer electronic component are disclosed. In an embodiment the dielectric composition includes particles having a perovskite crystal structure including at least Bi, Na, Sr and Ti, wherein at least some of the particles have a core-shell structure including a core portion and a shell portion and wherein the content of Bi present in the core portion is at least 1.2 times the content of Bi present in the shell portion.