The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Apr. 21, 2015
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Joshua M. Abeshaus, Gloucester, MA (US);

Jordan B. Tye, Arlington, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B29C 67/00 (2017.01); H01J 37/317 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29C 64/00 (2017.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B29C 64/00 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H01J 37/3171 (2013.01); B22F 2005/005 (2013.01); H01J 2237/002 (2013.01); H01J 2237/0041 (2013.01); H01J 2237/061 (2013.01); H01J 2237/2001 (2013.01); Y02P 10/295 (2015.11);
Abstract

Provided herein are approaches for forming a conduit embedded within a component of a semiconductor manufacturing device (e.g., an ion implanter) using an additive manufacturing process (e.g., 3-D printing), wherein the conduit is configured to deliver a fluid throughout the component to provide heating, cooling, and gas distribution thereof. In one approach, the conduit includes a set of raised surface features formed on an inner surface of the conduit for varying fluid flow characteristics within the conduit. In another approach, the conduit may be formed in a helical configuration. In another approach, the conduit is formed with a polygonal cross section. In another approach, the component of the ion implanter includes at least one of an ion source, a plasma flood gun, a cooling plate, a platen, and/or an arc chamber base.


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