The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Oct. 10, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chia-Hui Chen, Hsinchu, TW;

Wan-Yen Lin, Kaohsiung, TW;

Tsung-Hsin Yu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/003 (2006.01); H03K 17/00 (2006.01); H03K 3/356 (2006.01);
U.S. Cl.
CPC ...
H03K 19/00384 (2013.01); H03K 3/356113 (2013.01);
Abstract

A circuit includes: a first type of swing reduction circuit coupled between an input/output pad and a buffer circuit; and a second type of swing reduction circuit coupled between the input/output pad and the buffer circuit, wherein the first type of swing reduction circuit is configured to increase a voltage received by respective gates of a first subset of transistors of the buffer circuit when a voltage applied on the input/output pad is equal to a first supply voltage, and the second type of swing reduction circuit is configured to reduce a voltage received by respective gates of a second subset of transistors of the buffer circuit when the voltage applied on the input/output pad is equal to a second supply voltage.


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