Formation of structurally robust nanoscale ag-based conductive structure

Abstract

Providing for improved manufacturing of silver-based electrodes to facilitate formation of a robust metallic filament for a resistive switching device is disclosed herein. By way of example, a silver electrode can be embedded with a non-silver material to reduce surface energy of silver atoms of a silver-based conductive filament, increasing structural strength of the conductive filament within a resistive switching medium. In other embodiments, an electrode formed of a base material can include silver material to provide mobile particles for an adjacent resistive switching material. The silver material can drift or diffuse into the resistive switching material to form a structurally robust conductive filament therein.