The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Nov. 27, 2016
Applicant:

Tdk Electronics Ag, Munich, DE;

Inventors:

Alexander Glazunov, Deutschlandsberg, AT;

Adalbert Feltz, Deutschlandsberg, AT;

Assignee:

TDK ELECTRONICS AG, München, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/273 (2013.01); C04B 35/493 (2006.01); H01L 41/047 (2006.01); H01L 41/187 (2006.01); C04B 35/626 (2006.01); C04B 35/638 (2006.01); C04B 35/491 (2006.01); C04B 35/622 (2006.01); C04B 35/63 (2006.01); C04B 35/64 (2006.01); C04B 41/00 (2006.01); C04B 41/51 (2006.01); C04B 41/88 (2006.01);
U.S. Cl.
CPC ...
H01L 41/273 (2013.01); C04B 35/491 (2013.01); C04B 35/493 (2013.01); C04B 35/6261 (2013.01); C04B 35/6262 (2013.01); C04B 35/62222 (2013.01); C04B 35/62645 (2013.01); C04B 35/62685 (2013.01); C04B 35/6303 (2013.01); C04B 35/638 (2013.01); C04B 35/64 (2013.01); C04B 41/009 (2013.01); C04B 41/5111 (2013.01); C04B 41/88 (2013.01); H01L 41/0471 (2013.01); H01L 41/0477 (2013.01); H01L 41/187 (2013.01); H01L 41/1876 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3239 (2013.01); C04B 2235/3249 (2013.01); C04B 2235/3258 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3296 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/656 (2013.01); C04B 2235/658 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/6588 (2013.01); C04B 2235/768 (2013.01); C04B 2235/77 (2013.01); C04B 2235/786 (2013.01); C04B 2235/96 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method for producing a piezoelectric component is disclosed. In an embodiment, the method includes producing a ceramic precursor material of the general formula PbV″BaSr[(TiZr)WRE]O, where RE is a rare earth metal and V″ is a Pb vacancy, mixing the ceramic precursor material with a sintering aid, forming a stack which includes alternating layers including the ceramic precursor material and a layer including Cu and debindering and sintering the stack thereby forming the piezoelectric component having Cu electrodes and at least one piezoelectric ceramic layer including PbV″CuBaSr[(TiZr)WRE]O, where 0≤x≤0.035, 0≤y≤0.025, 0.42≤z≤0.5, 0.0045≤a≤0.009, 0.009≤b≤0.011, and 2a>b, p≤2a−b.


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