The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jul. 24, 2018
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kanagawa, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 29/778 (2006.01); H01L 29/16 (2006.01); H01L 21/48 (2006.01); H01L 29/20 (2006.01); H01L 21/304 (2006.01); H01L 29/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); H01L 21/304 (2013.01); H01L 21/4803 (2013.01); H01L 24/26 (2013.01); H01L 29/04 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/7786 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip including a substrate and an element region on the substrate, a heat transfer body made of diamond, and a metal layer between the semiconductor chip and the heat transfer body, wherein the substrate includes an amorphous region on a back surface thereof, the amorphous region and the metal layer are bonded to each other, and the metal layer and the heat transfer body are bonded to each other.