The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jun. 12, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Fred D. Fishburn, Aptos, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H05K 1/16 (2006.01); H01L 49/02 (2006.01); H01G 4/30 (2006.01); H01L 23/64 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01G 4/385 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H01L 23/642 (2013.01); H01L 28/00 (2013.01); H05K 1/162 (2013.01); H01G 4/40 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19104 (2013.01); H05K 2201/09763 (2013.01);
Abstract
Some embodiments include a capacitive chip having a plurality of capacitive units. The individual capacitive units include alternating electrode layers and dielectric layers in a capacitor stack. The capacitor stack extends across an undulating topography. The undulating topography has peaks and valleys with the peaks being elevationally offset relative to the valleys by a distance within a range of from about 30 microns to about 100 microns. The capacitor stack includes at least about 10 total layers. Some embodiments include apparatuses and multi-chip modules having capacitor chips.