The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Dec. 18, 2015
Applicants:

Ebara Corporation, Tokyo, JP;

Kyushu Institute of Technology, Fukuoka, JP;

Inventors:

Hisanori Matsuo, Tokyo, JP;

Yoshihiro Mochizuki, Tokyo, JP;

Keisuke Suzuki, Fukuoka, JP;

Takahiro Tajiri, Fukuoka, JP;

Panart Khajornrungruang, Fukuoka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 49/12 (2006.01); G01N 21/55 (2014.01); G01N 21/47 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 49/12 (2013.01); G01N 21/55 (2013.01); G01N 2021/4742 (2013.01); G01N 2201/06113 (2013.01); G01N 2201/0826 (2013.01);
Abstract

A polishing pad surface property measuring method which can measure surface properties of a polishing pad that reflect CMP performance by applying a laser beam to the polishing pad at a plurality of incident angles is disclosed. The method includes applying a laser beam to a surface of the polishing pad, and receiving light reflected by the surface of the polishing pad and performing Fourier transform on the received light to determine surface properties of the polishing pad. The laser beam is applied to the polishing pad at a plurality of incident angles.


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