The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Mar. 26, 2018
Applicant:

Laird Technologies, Inc., Earth City, MO (US);

Inventors:

Paul Francis Dixon, Sharon, MA (US);

Mohammadali Khorrami, Foxboro, MA (US);

Assignee:

Laird Technologies, Inc., Chesterfield, unknown;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0032 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 2201/10371 (2013.01);
Abstract

According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.


Find Patent Forward Citations

Dixon, Paul. (2019). Thermally-conductive electromagnetic interference (emi) absorbers positioned or positionable between board level shields and heat sinks (U.S. Patent No. 10477739). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10477739

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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