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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10477701 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Dec. 11, 2017

Circuit board and method for manufacturing the same

Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Po-Hsuan Liao, Taoyuan, TW;

Wen-Fang Liu, Taoyuan, TW;

Assignee:

UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;

Attorney:

CKC & Partners Co., LLC

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 21/02 (2006.01); H01L 21/31 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/70 (2006.01); H01L 21/768 (2006.01); H01L 21/4763 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 3/38 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); H05K 1/036 (2013.01); H05K 1/115 (2013.01); H05K 3/002 (2013.01); H05K 3/0023 (2013.01); H05K 3/0041 (2013.01); H05K 3/107 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/1453 (2013.01);
Abstract

A circuit board includes a substrate, a first dielectric layer, an adhesive layer, a second dielectric layer, and a conductive line. The first dielectric layer is disposed on the substrate. The adhesive layer is bonded to the first dielectric layer and has at least one through hole. The through hole has an inner wall. The second dielectric layer is disposed on the adhesive layer and has a second through hole communicated with the first through hole. The conductive line is located in the second through hole of the second dielectric layer and is in contact with the inner wall of the adhesive layer.

Find Patent Forward Citations

Liao, Po-Hsuan. (2019). Circuit board and method for manufacturing the same (U.S. Patent No. 10477701). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10477701

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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