The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jan. 11, 2019
Ibiden Co., Ltd., Ogaki, JP;
Teruyuki Ishihara, Ogaki, JP;
Shunsuke Sakai, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.