The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2019

Filed:

Sep. 08, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kohei Fukushima, Oshu, JP;

Hiromi Nitadori, Oshu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/44 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02126 (2013.01); C23C 16/4412 (2013.01); C23C 16/45546 (2013.01); C23C 16/45578 (2013.01); C23C 16/45589 (2013.01); H01L 21/0228 (2013.01); H01L 21/67017 (2013.01); H01L 21/6719 (2013.01); H01L 21/67109 (2013.01);
Abstract

A substrate processing apparatus includes an inner tube installed to accommodate a plurality of substrates and having a first opening, an outer tube configured to surround the inner tube, a movable wall installed inside the inner tube or between the inner tube and the outer tube, configured to be movable, and having a second opening, a gas supply part configured to supply a process gas to the substrates and an exhaust part installed outside the movable wall and configured to exhaust the process gas supplied to the substrates.


Find Patent Forward Citations

Fukushima, Kohei. (2019). Substrate processing apparatus (U.S. Patent No. 10475641). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10475641

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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