The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Jan. 30, 2017
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventor:
Gordon Charles Rouse, Dublin, CA (US);
Assignee:
KLA-TENCOR CORPORATION, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01B 11/06 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01B 11/06 (2013.01); G06T 2207/30148 (2013.01);
Abstract
A system, method, and computer program product are provided for inspecting a wafer using a film thickness map generated for the wafer. In use, a plurality of locations on a wafer are determined from a design of the wafer. Additionally, a measured brightness at each of the determined locations on the wafer is obtained. Further, a film thickness map for the wafer is generated from the obtained measurements. The wafer is then inspected using the film thickness map.