The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Mar. 09, 2016
Applicant:
Namics Corporation, Niigata, JP;
Inventor:
Fuminori Arai, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/66 (2006.01); C09J 11/06 (2006.01); C09J 133/06 (2006.01); C09J 163/00 (2006.01); H01L 27/14 (2006.01); C08G 59/18 (2006.01); C08G 59/56 (2006.01); C08G 59/68 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/06 (2006.01); C08G 59/62 (2006.01); G02B 7/02 (2006.01); G02B 7/08 (2006.01); G02B 19/00 (2006.01); H01L 27/146 (2006.01); C08K 5/378 (2006.01);
U.S. Cl.
CPC ...
C08G 59/66 (2013.01); C08G 59/184 (2013.01); C08G 59/56 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08K 3/36 (2013.01); C08K 5/005 (2013.01); C08K 5/06 (2013.01); C09J 11/06 (2013.01); C09J 133/06 (2013.01); C09J 163/00 (2013.01); G02B 7/021 (2013.01); G02B 7/08 (2013.01); G02B 19/0076 (2013.01); H01L 27/14 (2013.01); H01L 27/146 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); C08K 5/378 (2013.01);
Abstract
The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (A) thermosetting resin, (B) a particular thiol compound, and (C) a latent curing agent.