The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Jul. 02, 2018
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

Michael John Phillips, Camp Hill, PA (US);

Randall Robert Henry, Lebanon, PA (US);

Michael Joseph Tryson, Spring Grove, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H01R 12/72 (2011.01); H05K 1/14 (2006.01); H01R 12/55 (2011.01); H01R 12/70 (2011.01); H01R 13/514 (2006.01); H01R 13/518 (2006.01); H01R 13/6583 (2011.01); H01R 43/02 (2006.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H05K 3/3426 (2013.01); H01R 12/55 (2013.01); H01R 12/707 (2013.01); H01R 12/722 (2013.01); H01R 13/514 (2013.01); H05K 1/144 (2013.01); H05K 3/3436 (2013.01); H01R 12/57 (2013.01); H01R 13/518 (2013.01); H01R 13/6583 (2013.01); H01R 43/0256 (2013.01); H05K 2201/10189 (2013.01); H05K 2203/041 (2013.01);
Abstract

A contact assembly includes a contact array having contacts with transition portions between mating and terminating portions with contact tails extending to tips. The contact assembly has a dielectric contact holder holding the transition portions. The contact assembly has a solder ball module defining a board interface to a host circuit board. The solder ball module has a gathering housing with contact channels extending between a top and a bottom receiving contact tails of corresponding contacts. The gathering housing has solder balls arranged at the bottom at each contact channel being electrically connected to the tips of the contact tails and being configured to be reflow soldered to circuits of the host circuit board to electrically connect the contacts to the host circuit board.


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