The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

Aug. 27, 2015
Applicant:

Mikro Mesa Technology Co., Ltd., Apia, WS;

Inventors:

Li-Yi Chen, Tainan, TW;

Shih-Chyn Lin, Tainan, TW;

Hsin-Wei Lee, Tainan, TW;

Pei-Yu Chang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/60 (2010.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/00 (2013.01);
Abstract

A method for manufacturing at least one light emitting diode (LED) includes epitaxying at least one light emitting diode (LED) structure on a growth substrate; forming at least one supporting layer on the LED structure; temporarily adhering the supporting layer to a carrier substrate through an adhesive layer, in which the supporting layer has a Young's modulus greater than that of the adhesive layer; and removing the growth substrate from the LED structure.


Find Patent Forward Citations

Chen, Li-Yi. (2019). Method of manufacturing light emitting diodes having a supporting layer attached to temporary adhesive (U.S. Patent No. 10468361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10468361

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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