The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Dec. 08, 2017
Applicant:
Kandou Labs, S.a., Lausanne, CH;
Inventors:
Amin Shokrollahi, Préverenges, CH;
Brian Holden, Monte Sereno, CA (US);
David Stauffer, Essex Junction, VT (US);
Assignee:
KANDOU LABS, S.A., Lausanne, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/00 (2006.01); G06F 13/42 (2006.01); G06F 11/10 (2006.01); G11C 5/06 (2006.01); G06F 13/16 (2006.01); G06T 1/60 (2006.01); G06F 1/08 (2006.01); G06F 1/06 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4243 (2013.01); G06F 11/1004 (2013.01); G06F 13/1689 (2013.01); G11C 5/06 (2013.01); G06F 1/06 (2013.01); G06F 1/08 (2013.01); G06F 13/161 (2013.01); G06F 13/1673 (2013.01); G06T 1/60 (2013.01);
Abstract
Systems and methods for an Enhanced High Bandwidth Memory (EHBM) are described, utilizing fewer physical wires than a HBM interface with each wire operating at a much higher signaling rate. The same logical signals and commands of HBM are supported over this higher-speed transport, with the resulting lower wire count and reduced signal density allowing use of lower-cost interconnection such as an organic rather than a silicon interposer between GPU and DRAM stack.