The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

May. 19, 2015
Applicant:

Alpha Assembly Solutions Inc, Somerset, NJ (US);

Inventors:

Steven Prokopiak, Toms River, NJ (US);

Ellen S. Tormey, Princeton Junction, NJ (US);

Oscar Khaselev, Monmouth Junction, NJ (US);

Michael T. Marczi, Chester, NJ (US);

Bawa Singh, Marlton, NJ (US);

Assignee:

Alpha Assembly Solutions Inc., Somerset, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/16 (2006.01); C23F 1/02 (2006.01); H01L 21/3213 (2006.01); H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0216 (2014.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
C23F 1/16 (2013.01); C23F 1/02 (2013.01); H01L 21/32134 (2013.01); H01L 31/022425 (2013.01); H01L 31/18 (2013.01); H01L 31/02168 (2013.01); H01L 31/02363 (2013.01); H01L 31/022441 (2013.01); H01L 31/1804 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract

A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, <1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 Ω/α of the surface upon activation.


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