The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2019

Filed:

May. 07, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jimin Zhang, San Jose, CA (US);

Zhihong Wang, Santa Clara, CA (US);

Wen-Chiang Tu, Mountain View, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); H01L 21/304 (2006.01); B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 37/20 (2012.01); B24B 37/30 (2012.01); B24B 9/06 (2006.01); H01L 21/321 (2006.01); B24B 37/34 (2012.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B24B 37/04 (2013.01); B24B 9/065 (2013.01); B24B 37/013 (2013.01); B24B 37/042 (2013.01); B24B 37/105 (2013.01); B24B 37/205 (2013.01); B24B 37/30 (2013.01); B24B 37/345 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 22/26 (2013.01);
Abstract

Before a first surface of a substrate is polished using a chemical mechanical process, the substrate is transferred to a modification station. The substrate comprises a side wall connected with the first surface at an edge and a second surface opposite to the first surface and also connected to the side wall. The first surface is substantially flat. The side wall is substantially perpendicular to the first surface. The edge of the substrate is modified at the modification station by removing material from a region of the first surface. The side wall of the substrate is a boundary of the region. The modified edge comprises a modified first surface that tapers within the region towards the second surface. The side wall remains substantially perpendicular to the first surface.


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