The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Dec. 14, 2015
Mitsubishi Electric Corporation, Tokyo, JP;
Takuya Hamaguchi, Tokyo, JP;
Yosuke Nakata, Tokyo, JP;
Seiya Nakano, Tokyo, JP;
Masayoshi Tarutani, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An aluminum electrode () is provided on a semiconductor device (). A metallic film () for a solder joint is provided on the aluminum electrode (). The organic protective film () is apart from the metallic film (). An interval between the organic protective film () and the metallic film () is equal to or greater than half of a thickness of the organic protective film (). Thus, even when the organic protective film () is deformed during sinter joining, the stress is not transmitted to the metallic film (). Therefore, it is possible to prevent the solder connection metallic film () from cracking.