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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10461012 B1

PDFFull Text
Date of Patent:
Oct. 29, 2019

Filed:

Mar. 10, 2016

Semiconductor module with reinforcing board

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Akira Morozumi, Okaya, JP;

Hiromichi Gohara, Matsumoto, JP;

Takafumi Yamada, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Matthew L Reames

Assistant Examiner:

John A Bodnar

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); B23K 1/00 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01); B23K 101/14 (2006.01); B23K 101/40 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); B23K 1/0012 (2013.01); B23K 1/0016 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 23/49838 (2013.01); H01L 24/34 (2013.01); H01L 24/37 (2013.01); B23K 2101/14 (2018.08); B23K 2101/40 (2018.08); H01L 23/16 (2013.01); H01L 23/49811 (2013.01); H01L 23/49861 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.

Find Patent Forward Citations

Quick Actions:

Morozumi, Akira. (2019). Semiconductor module with reinforcing board (U.S. Patent No. 10461012). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10461012

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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