The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2019

Filed:

Nov. 09, 2017
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Shoichiro Ogata, Tokyo, JP;

Masaaki Kimura, Tokyo, JP;

Mitsutoshi Yahagi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); C25D 17/02 (2006.01); C25D 21/04 (2006.01); C25D 21/06 (2006.01); C25D 21/12 (2006.01); C25D 7/12 (2006.01); C25D 5/34 (2006.01); C25D 17/00 (2006.01); G01M 3/32 (2006.01); H01L 21/288 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
C25D 17/06 (2013.01); C25D 5/34 (2013.01); C25D 7/12 (2013.01); C25D 17/001 (2013.01); C25D 17/004 (2013.01); C25D 21/04 (2013.01); G01M 3/3209 (2013.01); G01M 3/3263 (2013.01); G01M 3/3281 (2013.01); H01L 21/2885 (2013.01); H01L 21/67126 (2013.01); H01L 21/68721 (2013.01); C25D 17/02 (2013.01); C25D 21/06 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01);
Abstract

There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.


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