The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Dec. 21, 2016
Applicant:

Vishay-siliconix, Santa Clara, CA (US);

Inventors:

Kyle Terrill, Santa Clara, CA (US);

Yuming Bai, Union City, CA (US);

Deva Pattanayak, Saratoga, CA (US);

Zhiyun Luo, San Jose, CA (US);

Assignee:

VISHAY-SILICONIX, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); H01L 29/407 (2013.01); H01L 29/41741 (2013.01); H01L 29/4238 (2013.01); H01L 29/4916 (2013.01); H01L 29/66734 (2013.01);
Abstract

First polysilicon (poly-1) is deposited into deep trenches that have been formed in a substrate. A first polysilicon polishing process is performed to planarize the exposed surfaces of the poly-1 so that the surfaces are flush with adjacent surfaces. Then, shallow trenches are formed in the substrate between the deep trenches, and second polysilicon (poly-2) is deposited into the shallow trenches. A second polysilicon polishing process is performed to planarize the exposed surface of the poly-2 so that the surface is flush with adjacent surfaces. Metal contacts to the poly-1 and the poly-2 are then formed.


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