The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Feb. 01, 2017
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Naoyuki Ohse, Tsukuba, JP;

Mina Ryo, Tsukuba, JP;

Takuya Komatsu, Kofu, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 21/04 (2006.01); H01L 29/78 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/0485 (2013.01); H01L 29/1087 (2013.01); H01L 29/401 (2013.01); H01L 29/66068 (2013.01); H01L 29/78 (2013.01);
Abstract

An interlayer insulating film is patterned, contact holes are formed, and in the contact holes, a source contact portion forming an ohmic contact with the silicon carbide body is formed. Thereafter, a titanium film and an aluminum wiring layer are continuously formed in this sequence on the interlayer insulating film and the source contact portion. At this time, the thickness of the titanium film is about 1.0 μm or less. Thereafter, by heat treatment for curing of a passivation film or heat treatment thereafter, the titanium film and the aluminum wiring layer react, generating a TiAl alloy film between the titanium film and the aluminum wiring layer. The thickness of the TiAl alloy film, for example, is kept to about 1 nm to 100 nm; and the TiAl alloy film and the source contact portion do not contact each other.


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