The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Apr. 24, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Chung Chen, Keelung, TW;

Chi-Feng Huang, Zhubei, TW;

Shu Fang Fu, Xinpu Township, TW;

Tzu-Jin Yeh, Hsin-Chu, TW;

Chewn-Pu Jou, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01); H01L 21/761 (2006.01); H01L 23/66 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 21/265 (2006.01); H01L 27/06 (2006.01); H01L 49/02 (2006.01); H01L 29/06 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/26513 (2013.01); H01L 21/761 (2013.01); H01L 21/7624 (2013.01); H01L 27/0629 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01L 29/0649 (2013.01); H01L 29/1083 (2013.01); H01L 29/41775 (2013.01); H01L 29/45 (2013.01); H01L 29/665 (2013.01); H01L 29/6656 (2013.01); H01L 29/6659 (2013.01); H01L 29/66568 (2013.01); H01L 29/7833 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6672 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A device includes a semiconductor substrate of a first conductivity type, and a deep well region in the semiconductor substrate, wherein the deep well region is of a second conductivity type opposite to the first conductivity type. The device further includes a well region of the first conductivity type over the deep well region. The semiconductor substrate has a top portion overlying the well region, and a bottom portion underlying the deep well region, wherein the top portion and the bottom portion are of the first conductivity type, and have a high resistivity. A gate dielectric is over the semiconductor substrate. A gate electrode is over the gate dielectric. A source region and a drain region extend into the top portion of the semiconductor substrate. The source region, the drain region, the gate dielectric, and the gate electrode form a Radio Frequency (RF) switch.


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