The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

May. 05, 2016
Applicant:

Win Semiconductors Corp., Tao Yuan, TW;

Inventors:

Pei-Chun Liao, Tao Yuan, TW;

Po-Wei Ting, Tao Yuan, TW;

Chih-Feng Chiang, Tao Yuan, TW;

Yu-Kai Wu, Tao Yuan, TW;

Yu-Fan Chang, Tao Yuan, TW;

Re-Ching Lin, Tao Yuan, TW;

Shu-Hsiao Tsai, Tao Yuan, TW;

Cheng-Kuo Lin, Tao Yuan, TW;

Assignee:

WIN SEMICONDUCTORS CORP., Tao Yuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2006.01); B81B 7/00 (2006.01); G01C 19/5783 (2012.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); B81B 7/0077 (2013.01); G01C 19/5783 (2013.01); H01L 24/29 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0271 (2013.01); B81B 2207/07 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2225/06541 (2013.01);
Abstract

A chip stack having a protection structure for semiconductor device package, which comprises a first chip and a second chip stacked with each other, wherein said first chip has a first surface, said second chip has a second surface, said first surface and said second surface are two surfaces facing to each other, wherein at least one metal pillar is formed on at least one of said first surface and said second surface and connected with the other, at least one protection ring is formed on at least one of said first surface and said second surface and having a first gap with the other, and at least one electrical device is formed on at least one of said first surface and said second surface, wherein said at least one electrical device is located inside at least one of said at least one protection ring.


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