The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Aug. 01, 2018
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 27/01 (2006.01); H01L 23/66 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3732 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 27/01 (2013.01); H01L 2223/6672 (2013.01);
Abstract
Aspects generally relate to an integrated circuit including a glass substrate. On a surface of the glass substrate a thermally conductive insulating layer is formed. At least one metal layer is formed above the thermally conductive insulating layer, and a plurality of thermal bumps extend through the at least one metal layer and couple to the thermally conductive insulating layer to dissipate heat from the substrate.