The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Apr. 08, 2016
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Chang Chin Tsai, Kaohsiung, TW;

Hsun-Wei Chan, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01); H01L 21/78 (2006.01); H01L 23/053 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/4803 (2013.01); H01L 21/50 (2013.01); H01L 21/78 (2013.01); H01L 23/32 (2013.01);
Abstract

A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.


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