The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Dec. 18, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ping Jiang, Plano, TX (US);

David Gerald Farber, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01L 21/3105 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/76808 (2013.01); H01L 21/76814 (2013.01); H01L 21/76826 (2013.01);
Abstract

A method of forming an interconnect structure for an integrated circuit. A dielectric stack is formed on the substrate including an etch-stop layer, a low-k or ULK dielectric layer, and a hard mask layer. The low-k or ULK dielectric is etched using at least two etching processes wherein each etching process is followed by an etch repair process where the etch repair process includes flowing at least one hydrocarbon into the reactor and generating a plasma. The photoresist may be removed using at least two ashing processes wherein each ashing process is followed by an ash repair process where the etch repair process includes flowing at least one hydrocarbon into the reactor and generating a plasma.


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