The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Mar. 26, 2018
Applicant:
Showa Denko K.k., Minato-ku, Tokyo, JP;
Inventors:
Takanori Kido, Hikone, JP;
Tomohisa Kato, Tsukuba, JP;
Assignee:
SHOWA DENKO K.K., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/321 (2006.01); H01L 21/02 (2006.01); C30B 29/36 (2006.01); C30B 33/00 (2006.01); H01L 29/16 (2006.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); B24B 37/245 (2013.01); C30B 29/36 (2013.01); C30B 33/00 (2013.01); H01L 21/02013 (2013.01); H01L 21/02024 (2013.01); H01L 21/3212 (2013.01); H01L 29/1608 (2013.01);
Abstract
A surface machining method for a single crystal SiC substrate, including: a step of mounting a grinding plate which includes a soft pad and a hard pad sequentially attached onto a base metal having a flat surface, a step of generating an oxidation product by using the grinding plate, and a step of grinding the surface while removing the oxidation product, wherein abrasive grains made of at least one metallic oxide that is softer than single crystal SiC and has a bandgap are fixed to the surface of the hard pad.