The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Nov. 09, 2017
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Ming-Chih Tsai, Taichung, TW;
Yu-Hsuan Ho, Taichung, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/20 (2006.01); H01L 51/42 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01G 9/2018 (2013.01); H01G 9/20 (2013.01); H01L 51/42 (2013.01); H01L 51/4253 (2013.01); C01P 2002/34 (2013.01); H01L 51/0077 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract
A perovskite composite structure is provided. The perovskite composite structure includes a light absorption layer and a sterically-hindered layer disposed in the periphery of the light absorption layer. The light absorption layer includes a perovskite material. The sterically-hindered layer includes a two-dimensional material.