The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Mar. 20, 2017
Applicant:
C. Uyemura & Co., Ltd., Osaka-shi, JP;
Inventors:
Assignee:
C. Uyemura & Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 5/44 (2006.01); C23C 18/54 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C23C 18/54 (2013.01); C25D 5/022 (2013.01); C25D 5/44 (2013.01);
Abstract
A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.