The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Mar. 28, 2018
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/12 (2006.01); C08F 290/14 (2006.01); C08F 299/02 (2006.01); C08G 73/22 (2006.01); G03F 7/027 (2006.01); G03F 7/20 (2006.01); G03F 7/031 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); H01L 23/498 (2006.01); C08G 73/10 (2006.01); C09D 179/08 (2006.01); C08G 73/14 (2006.01); G03F 7/023 (2006.01); G03F 7/075 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
C08G 73/12 (2013.01); C08F 290/14 (2013.01); C08F 299/02 (2013.01); C08G 73/1039 (2013.01); C08G 73/1053 (2013.01); C08G 73/1071 (2013.01); C08G 73/14 (2013.01); C08G 73/22 (2013.01); C09D 179/08 (2013.01); G03F 7/027 (2013.01); G03F 7/031 (2013.01); G03F 7/037 (2013.01); G03F 7/0387 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/2002 (2013.01); G03F 7/32 (2013.01); H01L 23/49894 (2013.01); C08J 2377/06 (2013.01); G03F 7/023 (2013.01); G03F 7/0757 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.