The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Aug. 22, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takeshi Honma, Tokyo, JP;

Toshiki Ito, Kawasaki, JP;

Jun Kato, Yokohama, JP;

Shiori Yonezawa, Tokyo, JP;

Youji Kawasaki, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); C09D 4/00 (2006.01); G03F 7/00 (2006.01); G02B 1/12 (2006.01); G03F 7/031 (2006.01); H01L 21/311 (2006.01); H01L 21/3115 (2006.01);
U.S. Cl.
CPC ...
C08F 2/50 (2013.01); C09D 4/00 (2013.01); G02B 1/12 (2013.01); G03F 7/0002 (2013.01); G03F 7/031 (2013.01); H01L 21/31144 (2013.01); H01L 21/31155 (2013.01);
Abstract

A curable composition for photoimprint at least includes a polymerizable compound component (A) and a photopolymerization initiator component (B) and satisfies expression (1) and (2):0.800≤  (1)2.55≤Er  (2)wherein, Errepresents the reduced modulus (GPa) of a photocured film prepared by exposing a film of the curable composition for photoimprint to light of 10 mJ/cm; and Errepresents the reduced modulus (GPa) of a photocured film prepared by exposing a film of the curable composition for photoimprint to light of 200 mJ/cm.


Find Patent Forward Citations

Loading…