The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jan. 03, 2019
Agc Inc., Chiyoda-ku, JP;
Tomoya Hosoda, Chiyoda-ku, JP;
Tatsuya Terada, Chiyoda-ku, JP;
AGC Inc., Chiyoda-ku, JP;
Abstract
To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it. A wiring substratecomprising an electrical insulator layera first conductor layerformed on a first surface of the electrical insulator layera second conductor layerformed on a second surface of the electrical insulator layerand a plating layerprovided on an inner wall surface of a holewhich opens from the first conductor layerthrough the second conductor layerwherein the electrical insulator layerhas a heat resistant resin layercontaining a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layerand the electrical insulator layerhas a dielectric constant of from 2.0 to 3.5.