The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

May. 13, 2016
Applicant:

Rogers Germany Gmbh, Eschenbach, DE;

Inventors:

Andreas Meyer, Wenzenbach, DE;

Stefan Britting, Schnaittach, DE;

Dieter Knöchel, Eckersdorf, DE;

David Bierwagen, Schnaittach, DE;

Assignee:

ROGERS GERMANY GMBH, Eschenbach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 1/03 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); C04B 37/026 (2013.01); C04B 2237/12 (2013.01); C04B 2237/124 (2013.01); C04B 2237/125 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/346 (2013.01); C04B 2237/348 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/403 (2013.01); C04B 2237/405 (2013.01); C04B 2237/406 (2013.01); C04B 2237/407 (2013.01); C04B 2237/52 (2013.01); C04B 2237/708 (2013.01); C04B 2237/86 (2013.01);
Abstract

A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 μm; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.


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