The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Sep. 04, 2018
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Tan-Ya Yin, Nantou County, TW;

Chia-Wei Huang, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/119 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 21/308 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 21/3085 (2013.01); H01L 29/4238 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/0692 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate and a patterned metal gate layer. The substrate includes a first fin segment and a second fin segment respectively protruding from a top surface of the substrate. The first fin segment and the second fin segment respectively extend along a first direction and are arranged along a second direction, the first fin segment comprises a first fin structure at an end of the first fin segment, and the second fin segment comprises a first recess at an end of the second fin segment, and the first recess and the first fin structure are arranged along the second direction. The patterned metal gate layer is disposed on the substrate, and the patterned metal gate layer covers the first fin structure.


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