The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Feb. 21, 2018
Applicant:

Sumitomo Electric Device Innovations, Inc., Yokohama-shi, JP;

Inventor:

Masaomi Emori, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 2224/32506 (2013.01); H01L 2224/83411 (2013.01); H01L 2224/83444 (2013.01);
Abstract

A process of forming a semiconductor apparatus is disclosed. The process includes steps of: depositing a first metal layer containing Ni in a back surface of a substrate, plating the back surface of the substrate so as to expose the first metal layer in a portion of the scribe line, depositing a third metal layer on the whole back surface of the substrate, and selectively removing the third metal layer in the portion of the scribe line so as to leave the first metal layer in the scribe line.


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Emori, Masaomi. (2019). Process of forming semiconductor apparatus mounting on substrate (U.S. Patent No. 10446510). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10446510

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