The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Mar. 07, 2018
Fuji Electric Co., Ltd., Kanagawa, JP;
Hiromichi Gohara, Nagano, JP;
Kohei Yamauchi, Nagano, JP;
Shinji Tada, Tokyo, JP;
Tatsuo Nishizawa, Nagano, JP;
Yoshitaka Nishimura, Nagano, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
The semiconductor device includes a first insulating circuit substrate; a semiconductor chip including a plurality of control electrodes, disposed on the first insulating circuit substrate; a second insulating circuit substrate including a plurality of first through-holes in which conductive members are arranged on inner walls and/or an outer periphery of ends of the first through-holes, the second insulating circuit substrate being disposed above the semiconductor chips; and first pins inserted into the first through-holes and having at one end a columnar part connected to the control electrodes of the semiconductor chips, and having at another end a head part that is wider than an inner diameter of the first through-holes.