The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Nov. 27, 2014
Applicant:
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;
Inventors:
Dror Hurwitz, Zhuhai, CN;
Alex Huang, Zhuhai, CN;
Assignee:
Zhuhai ACCESS Semiconductor Co., Ltd., Zhuhai, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01G 17/00 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/33 (2006.01); H01G 4/224 (2006.01); H01G 4/228 (2006.01); H01L 49/02 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01F 27/28 (2006.01); H03H 7/01 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01G 17/00 (2013.01); H01G 4/008 (2013.01); H01G 4/1209 (2013.01); H01G 4/224 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H01L 28/65 (2013.01); H05K 1/115 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 3/4647 (2013.01); H01F 27/2804 (2013.01); H01L 23/49827 (2013.01); H01L 24/24 (2013.01); H01L 24/97 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24195 (2013.01); H01L 2924/19105 (2013.01); H03H 7/0115 (2013.01); H05K 1/186 (2013.01); H05K 3/005 (2013.01); H05K 3/0052 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09627 (2013.01); H05K 2201/09672 (2013.01); H05K 2203/308 (2013.01);
Abstract
A chip socket defined by an organic matrix framework, wherein the organic matrix framework comprises at least one via post layer where at least one via through the framework around the socket includes at least one capacitor comprising a lower electrode, a dielectric layer and an upper electrode in contact with the via post.