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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10444628 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Dec. 07, 2016

Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Kori, Jyoetsu, JP;

Tsutomu Ogihara, Jyoetsu, JP;

Takeru Watanabe, Jyoetsu, JP;

Yoshinori Taneda, Jyoetsu, JP;

Kazunori Maeda, Jyoetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Martin J Angebranndt

Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); C07C 49/653 (2006.01); C07C 49/683 (2006.01); H01L 21/311 (2006.01); H01L 21/033 (2006.01); C07D 311/92 (2006.01); C07C 39/23 (2006.01); C07C 43/215 (2006.01); C07C 43/285 (2006.01); H01L 21/30 (2006.01); H01L 21/027 (2006.01); G03F 7/09 (2006.01); C09D 5/00 (2006.01); G03F 1/32 (2012.01); G03F 7/004 (2006.01); G03F 7/32 (2006.01); H01L 21/308 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); C07C 39/23 (2013.01); C07C 43/215 (2013.01); C07C 43/285 (2013.01); C07C 49/653 (2013.01); C07C 49/683 (2013.01); C07D 311/92 (2013.01); C09D 5/008 (2013.01); G03F 1/32 (2013.01); G03F 7/0045 (2013.01); G03F 7/039 (2013.01); G03F 7/0752 (2013.01); G03F 7/091 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2041 (2013.01); G03F 7/322 (2013.01); H01L 21/0274 (2013.01); H01L 21/0332 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); C07C 2603/12 (2017.05); C07C 2603/18 (2017.05); C07C 2603/40 (2017.05); C07C 2603/52 (2017.05); C07C 2603/54 (2017.05); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01);
Abstract

A compound for forming an organic film shown by the formula (1A),RX)  (1A)wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and m1 represents an integer satisfying 2≤m1≤10, wherein Xrepresents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; Xrepresents a group shown by the formula (1C); and n5 represents 0, 1, or 2, wherein Rrepresents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.

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