The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Oct. 10, 2014
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Satoru Mori, Okegawa, JP;
Shozo Komiyama, Sanda, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/06 (2006.01); C23C 14/34 (2006.01); H01J 37/34 (2006.01); C23C 14/14 (2006.01); C23C 14/00 (2006.01); C23C 14/16 (2006.01); C23C 30/00 (2006.01); C23C 28/02 (2006.01); C22C 9/05 (2006.01);
U.S. Cl.
CPC ...
C22C 9/06 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C23C 14/00 (2013.01); C23C 14/14 (2013.01); C23C 14/16 (2013.01); C23C 14/165 (2013.01); C23C 14/34 (2013.01); C23C 14/3407 (2013.01); C23C 14/3414 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01J 37/3426 (2013.01); C22C 9/05 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01);
Abstract
A sputtering target is provided for forming a protective film which is used for forming a protective film on a single surface or both surfaces of a Cu wiring film, the sputtering target including 5 to 15 mass % of Ni or Ni and Al in total (where the Ni content is 0.5 mass % or higher); 0.1 to 5.0 mass % of Mn; 0.5 to 7.0 mass % of Fe; and a balance including Cu and inevitable impurities.