The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Mar. 24, 2017
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yoshitaka Kamochi, Haibara-gun, JP;

Ichiro Koyama, Haibara-gun, JP;

Yu Iwai, Haibara-gun, JP;

Atsushi Nakamura, Haibara-gun, JP;

Mitsuru Sawano, Haibara-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/00 (2018.01); C09J 11/06 (2006.01); C09J 121/00 (2006.01); H01L 21/02 (2006.01); B32B 7/12 (2006.01); B32B 25/04 (2006.01); C09J 153/02 (2006.01); H01L 21/683 (2006.01); C08J 3/09 (2006.01); C09J 7/10 (2018.01); B32B 7/04 (2019.01); B32B 7/06 (2019.01); B32B 9/04 (2006.01); B32B 15/06 (2006.01); B32B 25/12 (2006.01); B32B 25/14 (2006.01); B32B 25/16 (2006.01); B32B 25/18 (2006.01); B32B 25/20 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 25/08 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/38 (2006.01); B32B 27/42 (2006.01); B32B 3/08 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C09J 11/06 (2013.01); B32B 3/08 (2013.01); B32B 7/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 9/043 (2013.01); B32B 15/06 (2013.01); B32B 25/04 (2013.01); B32B 25/08 (2013.01); B32B 25/12 (2013.01); B32B 25/14 (2013.01); B32B 25/16 (2013.01); B32B 25/18 (2013.01); B32B 25/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/28 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/325 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08J 3/092 (2013.01); C09J 7/00 (2013.01); C09J 7/10 (2018.01); C09J 121/00 (2013.01); C09J 153/025 (2013.01); H01L 21/02 (2013.01); H01L 21/6836 (2013.01); B32B 2250/03 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/30 (2013.01); B32B 2307/306 (2013.01); B32B 2307/51 (2013.01); B32B 2307/58 (2013.01); B32B 2307/584 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2457/14 (2013.01); C08J 5/18 (2013.01); C08J 2309/06 (2013.01); C08J 2353/02 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2453/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), Rto Reach independently represent a hydrogen atom or an aliphatic hydrocarbon group.


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