The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Sep. 27, 2016
Applicant:
Agc Inc., Chiyoda-ku, JP;
Inventors:
Kohei Horiuchi, Chiyoda-ku, JP;
Motoshi Ono, Chiyoda-ku, JP;
Assignee:
AGC Inc., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/08 (2006.01); B23K 26/073 (2006.01); B23K 26/0622 (2014.01); B23K 26/382 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/082 (2013.01); B23K 26/0622 (2015.10); B23K 26/382 (2015.10); B23K 26/402 (2013.01); B23K 2103/54 (2018.08);
Abstract
Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.