The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Jan. 31, 2019
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Gernot Grober, Graz, AT;
Abstract
A method of manufacturing a component carrier is disclosed. The method includes forming a through hole between a first main surface and a second main surface of an electrically insulating layer structure by removing material from at least one of the main surfaces of the electrically insulating layer structure, in particular by irradiating at least one of the main surfaces of the electrically insulating layer structure with at least one laser shot. The at least one main surface from which material is removed, is not covered by an electrically conductive layer structure at least in a surface region in which the through hole is to be formed. Subsequent to formation of the through hole, at least partially filling the through hole and at least partially covering the main surfaces of the electrically insulating layer structure by an electrically conductive filling medium.