The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Mar. 15, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Robert H. Dennard, Croton-on-Hudson, NY (US);

Rajiv V. Joshi, Yorktown Heights, NY (US);

Richard Q. Williams, Essex Junction, VT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/786 (2006.01); H01L 21/285 (2006.01); H01L 29/423 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66742 (2013.01); H01L 21/28562 (2013.01); H01L 29/0607 (2013.01); H01L 29/1608 (2013.01); H01L 29/4236 (2013.01); H01L 29/66545 (2013.01); H01L 29/78696 (2013.01);
Abstract

The present invention provides for a method of fabricating a semiconductor device, the method includes depositing a nitride layer on an ETSOI layer; forming a dummy gate over the nitride layer; forming nitride gate spacers from the nitride layer; growing a sacrificial layer on the ETSOI layer, the sacrificial layer composing a material that can be at least partially converted to a metal layer by a metal-bearing gas; forming refractory metal contacts using the sacrificial layer and a consumptive process; depositing an oxide protect layer on the refractory metal contacts; removing the dummy gate using a mask and etch process combined with chemical-mechanical polishing (CMP); etching the ETSOI layer to form a U-shaped channel; and depositing the final gate stack into the U-shaped channel.


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