The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
Apr. 12, 2018
Applicant:
Ubiq Semiconductor Corp., Zhubei, Hsinchu County, TW;
Inventors:
Masamichi Yanagida, Gunma-ken, JP;
Nobuyoshi Matsuura, Gunma-ken, JP;
Assignee:
uPI SEMICONDUCTOR CORP., Zhubei, Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 29/788 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/28 (2006.01); H01L 21/44 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/304 (2013.01); H01L 21/3043 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A semiconductor device manufacturing method is disclosed. The semiconductor device manufacturing method includes: a preparation step of preparing a semiconductor wafer; a removal step of removing a thickness part of the semiconductor wafer; and a cutting step of cutting the semiconductor wafer. In the removal step, a rib-shaped portion partially raised on a second main surface of the semiconductor wafer is used as an alignment mark, so that a cutter can align with the semiconductor wafer.