The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Dec. 05, 2017
Applicant:

Tokyo Electron Limited, Minato-ku, JP;

Inventor:

Jun Shinagawa, San Jose, CA (US);

Assignee:

Tokyo Electron Limited, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/66 (2006.01); G01N 21/73 (2006.01); H01L 21/67 (2006.01); G01J 3/443 (2006.01); G01N 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); G01N 21/73 (2013.01); H01J 37/3299 (2013.01); H01J 37/32183 (2013.01); H01J 37/32935 (2013.01); H01J 37/32972 (2013.01); H01J 37/32981 (2013.01); H01L 22/10 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G01J 3/443 (2013.01); G01N 21/68 (2013.01); H01J 2237/24507 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01); H01L 21/67069 (2013.01); H01L 21/67248 (2013.01); H01L 21/67253 (2013.01); H01L 22/26 (2013.01);
Abstract

A method and a system for plasma etching are provided. The method includes measuring a first set of plasma etch processing parameters; determining an etch rate; altering the plasma etch processing chamber hardware configuration if the determined etch rate differs from a standard etch rate by more than a predetermined etch rate difference threshold, thereafter repeating the determining and altering until the determined etch rate differs from the standard etch rate by less than the predetermined etch rate difference threshold. The method further includes measuring a critical dimension of an etched feature and altering the etch processing parameters if the measured critical dimension differs from a standard critical dimension by more than a predetermined critical dimension difference threshold, thereafter repeating the determining and altering until the measured critical dimension differs from the standard critical dimension by less than the predetermined critical dimension difference threshold.


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