The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Jul. 18, 2017
Applicant:

Mpi Corporation, Hsinchu Shien, TW;

Inventors:

Yu-Chen Hsu, Hsinchu Shien, TW;

Yu-Wen Wang, Hsinchu Shien, TW;

Horng-Kuang Fan, Hsinchu Shien, TW;

Mao-Fa Shen, Hsinchu Shien, TW;

Assignee:

MPI CORPORATION, Chu-Pei, Hsinchu Shien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 1/20 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06727 (2013.01); G01R 1/06744 (2013.01); G01R 1/20 (2013.01); G01R 3/00 (2013.01);
Abstract

A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too.


Find Patent Forward Citations

Loading…